1pcs 25K/Bottle BGA Reballing Ball Solder 0.2 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65mm Ball Solder IC Chip Welding Accessories

Price in reward points: 5
  • Brand: unbranded
  • Product Code: CN230811673081
  • Availability: 89970
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1pcs 25K/Bottle BGA Reballing Ball Solder 0.2 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65mm Ball Solder IC Chip Welding Accessories


Features:

1.Solder (Tin) paste is the best choice of reballing IC.


2.It is used instead of the pin in the IC component package structure.


3.Please Note: There are 25000Pcs/Bottle.The size of the bottle is fixed.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls,the product will only occupy a small space for the bottle.


Brand new and high quality.


Tin ball:, 0.65,0.6, 0.55, 0.5, 0.45, 0.40, 0.35, 0.3, 0.25, 0.2MM


Color:As picture


Balls Alloy: Sn63/Pb37


Standard: RoHs Available & SGS Tested


Quantity:25000pcs/bottle





Package Include:


25000pcs/bottle



Notice:

1.1cm=10mm=0.39inch.


2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.


3.Please understand that colors may exist chromatic aberration as the different placement of pictures.




CertificationCE
Model25K/Bottle BGA Solder Ball
Model NumberBGA Solder Ball 0.2-0.76MM
OriginMainland China
Particle Size1-10μm

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Tags: 1pcs 25K/Bottle BGA Reballing Ball Solder 0.2 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65mm Ball Solder IC Chip Welding Accessories