1pcs 25K/Bottle BGA Reballing Ball Solder 0.2 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65mm Ball Solder IC Chip Welding Accessories
- Brand: unbranded
- Product Code: CN230811673081
- Availability: 89970
1pcs 25K/Bottle BGA Reballing Ball Solder 0.2 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65mm Ball Solder IC Chip Welding Accessories
Features:
1.Solder (Tin) paste is the best choice of reballing IC.
2.It is used instead of the pin in the IC component package structure.
3.Please Note: There are 25000Pcs/Bottle.The size of the bottle is fixed.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls,the product will only occupy a small space for the bottle.
Brand new and high quality.
Tin ball:, 0.65,0.6, 0.55, 0.5, 0.45, 0.40, 0.35, 0.3, 0.25, 0.2MM
Color:As picture
Balls Alloy: Sn63/Pb37
Standard: RoHs Available & SGS Tested
Quantity:25000pcs/bottle
Package Include:
25000pcs/bottle
Notice:
1.1cm=10mm=0.39inch.
2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.
3.Please understand that colors may exist chromatic aberration as the different placement of pictures.
Certification | CE |
Model | 25K/Bottle BGA Solder Ball |
Model Number | BGA Solder Ball 0.2-0.76MM |
Origin | Mainland China |
Particle Size | 1-10μm |
Tags: 1pcs 25K/Bottle BGA Reballing Ball Solder 0.2 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65mm Ball Solder IC Chip Welding Accessories