BGA Repair Tool
Ball grid array packages sit under the chip, so reworking them needs controlled heat from below as well as above. These tools bring the board up to reflow temperature in a profile you can repeat, then let you lift the package and clean the pads without tearing them.
The range covers infrared and hot air rework stations, preheaters, reballing stencils and the consumables used with them. Tell us the package size and pitch you work with and we will suggest a station.
