BGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding Accessories

Brand Model CN230811673081 Availability 89970
  • Solder (Tin) paste is the best choice of reballing IC.
  • It is used instead of the pin in the IC component package structure.
  • Please Note: There are 25000Pcs/Bottle.The size of the bottle is fixed.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls...
  • Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.
  • Please understand that colors may exist chromatic aberration as the different placement of pictures.
Model
25K/Bottle BGA Solder Ball
Model Number
BGA Solder Ball 0.2-0.76MM
Particle Size
1-10μm
Certification
CE
Origin
Mainland China

Reply within 24 hours · 12-month warranty

1pcs 25K/Bottle BGA Reballing Ball Solder 0.2 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65mm Ball Solder IC Chip Welding Accessories

Features:

1.Solder (Tin) paste is the best choice of reballing IC.

2.It is used instead of the pin in the IC component package structure.

3.Please Note: There are 25000Pcs/Bottle.The size of the bottle is fixed.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls,the product will only occupy a small space for the bottle.

Brand new and high quality.

Tin ball:, 0.65,0.6, 0.55, 0.5, 0.45, 0.40, 0.35, 0.3, 0.25, 0.2MM

Color:As picture

Balls Alloy: Sn63/Pb37

Standard: RoHs Available & SGS Tested

Quantity:25000pcs/bottle

Package Include:

25000pcs/bottle

Notice:

1.1cm=10mm=0.39inch.

2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.

3.Please understand that colors may exist chromatic aberration as the different placement of pictures.

BGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding Accessories

BGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding AccessoriesBGA Reballing Solder Balls - 0.2mm to 0.65mm IC Chip Welding Accessories

Certification CE
Model 25K/Bottle BGA Solder Ball
Model Number BGA Solder Ball 0.2-0.76MM
Origin Mainland China
Particle Size 1-10μm

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